What's Flip-Chip?

The name “Flip-chip” describes the method used to connect a semiconductor die to a substrate, which contrasts with conventional wire-bonding and ball-grid-array packaging.


In a Flip-chip package the dies are bumped and then “flipped” onto a substrate, hence the name “Flip-chip”, while conventional chip is composed of P -GaN, an active layer, N-GaN and Sapphire substrate from top to bottom.


Advantages of Flip-chip Packaging includes at least:

 1) Enabling much smaller chip and thus micro-led display; 

 2) Dissipating heat more efficiently and expanding the screen’s lifetime;

 3) Efficient heat dissipation and great energy saving;

 4) Largely improved stability under high brightness.

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