Flipchip COB (Chip on Board) is the process of pasting the bare chip directly on the PCB board, then bonding the leads, and then using organic glue to cover the chip and the leads.
GOB (Glue on Board) is the technology of encapsulating the chip in the LED first, then soldering it on the PCB board, and finally using the epoxy resin with super high transparency and super thermal conductivity to do the integrated gluing.
