The advancements in electronic packaging aim to boost performance, reduce costs, and enhance package density. And the circuits' dependability is improved in the process. For example, setting a semiconductor chip onto a circuit board with its flat side down conserves valuable real estate since no additional room is required to connect to its sides. As a bonus, flip-chip technology is used in the process.
The use of a flip-chip design is not cutting-edge. Since the 1960s, IBM Corporation has been developing flip-chip technology to connect the chips' bonding pads to the substrate's metallization. Controlled Collapse Chip Connection (C4) is the first technology suggested to replace wire bolding, increase IO density, and decrease cost.
Bonding pads on chips are first given under bump metallurgy (UBM) to provide a strong connection between the pads and the bumps in the C4 process. Layers of barrier and adhesion, wetting, and an oxidation barrier are the three main components of UBM.
In high-frequency uses, flip-flop technology outperforms alternatives. The short connecting paths made possible by flip-flop technology allow for this. And since there are fewer points of failure, the dependability is higher than that of packaged parts. Flip-chip technology relies on a single bonded layer between the chip and the board.
The Benefits of Flip-chip Technology
Lighter and shorter due to the tiny IC footprint, which is only around 5% of that of packed IC.
The costs of batch bumping and under-filling may be reduced by using flip-chip technology.
Flip-flop technology can reduce the number of connections per pin from three to one, greatly improving reliability. As an added safety measure, large chips are filled with epoxy to increase their dependability further.
Low capacitance, inductance, resistance, electric delays, and improved high-frequency characteristics, among other benefits, are all made possible by interconnects that are both short and compact.
An increase in input/output (I/O) capability is one benefit of using flip flops. I/O is not confined to the chip's borders as it is with wire bonding. The 400 pads on a flip-chip are no problem for it.
Why LP Displays Use Flip-chip Technology
Future technologies will likely include flip-chips. It will further reshape the product and process options for the die's connectivity to the outside world. LP Display's Dongguan Huangjiang production center and Hunan Zhuzhou LP industrial park are two of its many impressive manufacturing bases. With a total area of 15000 square meters, our Dongguan factory has an impressive manufacturing capability that allows us to guarantee you the quickest turnaround time possible. Contact LP Display to learn more about flip chips.
